Technology
Breaking Copper Limits,
Unleashing AI Scalability
Conventional copper interconnects face severe physical bottlenecks at high speeds and long reaches, including signal attenuation, high power consumption, and thermal dissipation challenges. Through high-density Optical I/O, Porotech replaces long-reach electrical links with optics—boosting reach, bandwidth density, and energy efficiency to eliminate AI scaling bottlenecks.
Beyond Single-Lane Limits:
Massive Parallelism
Rather than chasing single-lane peak speeds that run into thermal hotspots and power walls, Porotech’s Optical I/O platform deploys a massively parallel optical strategy. By driving hundreds of low-power optical lanes concurrently, we maximize aggregate bandwidth density (Tbps/mm2) and flexibly meet diverse architectural demands (such as chip-to-chip Scale-In integration), delivering an end-to-end optical interconnect solution from package to rack.
End-to-End Optical I/O Platform
Porotech vertically integrates four core pillars across optics and semiconductors—Tx/Rx, drive electronics, optical routing, and advanced packaging—to deliver complete full-stack architectures.From rack-level fabrics down to chip and memory tiers, we empower customers to overcome the bandwidth density and power walls of conventional electrical I/O.
Breaking AI Compute Bottlenecks
at Every Tier
Scale-Out (Horizontal Scaling)
Scale-Up (Vertical Scaling)
Scale-In (In-Package Integration)
Tailored Optical Sources
